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Executive Committee

Program Committees

Previous Conferences


Executive Technical Program Committee
Tayfun Akin
Middle East Technical University
TURKEY

 Chee-Yee Kwok
University of New South Wales
AUSTRALIA
David Arnold
University of Florida
USA

 Franz Laermer
Robert Bosch GmbH
GERMANY
Rashid Bashir
University of Illinois, Urbana-Champaign
USA

 Zhihong Li
Peking University
CHINA
Jürgen Brugger
EPFL
SWITZERLAND

 Ellis Meng
University of Southern California
USA
Corrado Di Natale
University of Rome Tor Vergata
ITALY

 Jianmin Miao
Nanyang Technological University
SINGAPORE
David Elata
Technion - Israel Institute of Technology
ISRAEL

 Dave Monk
Freescale Semiconductor
USA
Weileun Fang
National Tsing Hua University
TAIWAN

 Liviu Nicu
CNRS
FRANCE
Gary Fedder
Carnegie Mellon University
USA

 Pasqualina M. Sarro
Delft University of Technology
THE NETHERLANDS
Sami Franssila
Aalto University
FINLAND

 Shuichi Shoji
Waseda University
JAPAN
Luc Fréchette
Université de Sherbrooke
CANADA

 Shoji Takeuchi
University of Tokyo
JAPAN
Reza Ghodssi
University of Maryland
USA

 Evelyn Wang
Massachusetts Institute of Technology
USA
Amy Herr
University of California, Berkeley
USA

 Eric Yeatman
Imperial College London
UK
Jerwei Hsieh
Asia Pacific Microsystems
TAIWAN

 Jun-Bo Yoon
Korea Advanced Institute of Science and Technology
SOUTH KOREA
Satoshi Konishi
Ritsumeikan University
JAPAN

 


Technical Program Committee

Chang-Wook BaekChung-Ang University, SOUTH KOREA
Giuseppe BarillaroUniversity of Pisa, ITALY
Nicolae BarsanUniversity of Tübingen, GERMANY
István BársonyHungarian Academy of Sciences, HUNGARY
Rajashree BaskaranIntel, USA
Sarah BedairArmy Research Lab (ARL), USA
Sunil BhaveCornell University, USA
Jong-Uk BuSenPlus, SOUTH KOREA
Lionel BuchaillotIEMN, CNRS, FRANCE
Cullen BuieMassachusetts Institue of Technology, USA
Yu-Ting ChengNational Chiao Tung University, TAIWAN
Mu ChiaoUniversity of British Columbia, CANADA
Marina ColeUniversity of Warwick, UK
Jesús M. CorresUniversity of Navarra, SPAIN
Petra DittrichETH Zurich, SWITZERLAND
Jens DucréeDublin City University, IRELAND
Isabelle DufourIMS,CNRS, FRANCE
Amy DuwelDraper Labs, USA
Phillip FengCase Western Reserve University, USA
Maximilian FleischerSiemens AG, GERMANY
Hans GardeniersUniversity of Twente, THE NETHERLANDS
Einar HalvorsenHiVe, NORWAY
Andreas HierlemannETH Zurich, SWITZERLAND
Qing-An HuangSoutheast University , CHINA
Adrian IonescuEPFL, SWITZERLAND
Bernhard JakobyJKL University, AUSTRIA
Ki-Hun JeongKAIST, SOUTH KOREA
Hanseup KimUniversity of Utah, USA
Jongbaeg KimYonsei University, SOUTH KOREA
Sunghoon KwonSeoul National University, SOUTH KOREA
Jeroen LammertynKU Leuven, BELGIUM
Chengkuo LeeNational University of Singapore, SINGAPORE
Yi-Kuen LeeHong Kong University of Science and Technology, HONG KONG
Sheng-Shian LiNational Tsing-Hua University, TAIWAN
Xinxin LiShanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, CHINA
Che-Hsin LinNational Sun Yat-sen University, TAIWAN
Yu-Cheng LinNational Cheng Kung Univ., TAIWAN
Carol LivermoreNortheastern, USA
Mary Ann MahersoftMEMS, USA
Matthew McCarthyDrexel University, USA
Norihisa MikiKeio University, JAPAN
Paul MitchesonImperial College, UK
Takahiro NishimotoShimadzu Corporation, JAPAN
Gary O'BrienBosch, USA
Connor O'MahonyTyndall Institute, IRELAND
Joachim OberhammerKTH, SWEDEN
Takahito OnoTohoku University, JAPAN
Sumita PennathurUniversity of California at Santa Barbara, USA
Gianluca PiazzaCarnegie Mellon University, USA
Beth PruittStanford University, USA
Mina Rais-ZadehUniversity of Michigan, USA
Luis RochaUniversity do Minho, PORTUGAL
Xavier RottenbergIMEC, BELGIUM
Kazuaki SawadaToyohashi University of Technology, JAPAN
Tiina SikanenUniversity of Helsinki, FINLAND
Elisabeth SmelaUniversity of Maryland, USA
Chip SpanglerAspen Technologies, USA
Yu SunUniversity of Toronto, CANADA
Yuji SuzukiUniversity of Tokyo, JAPAN
Srinivas TadigadapaPenn State University, USA
Shuji TanakaTohoku University, JAPAN
Svetlana Tatic-LucicLehigh University, USA
Hiroshi ToshiyoshiUniversity of Tokyo, JAPAN
Alex TrusovNorthrop Grumman, USA
Fan-Gang TsengNational Tsing-Hua University, TAIWAN
Toshiyuki TsuchiyaKyoto University, JAPAN
Joost van BeekNXP Semiconductors, THE NETHERLANDS
Michael VellekoopUniversity of Bremen, GERMANY
Xiao-Hong WangTsinghua University, CHINA
Peter WoiasIMTEK, GERMANY
Man WongHong Kong University of Science & Technology, HONG KONG
Wengang WuPeking University, CHINA
Yong-Kyu YoonUniversity of Florida, USA
Xin ZhangBoston University, USA
Maryam Ziaei-MoayyediSono Health, USA




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