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General Info



Executive Committee

Program Committees

Previous Conferences


General Chair
Thomas W. Kenny
Stanford University
USA
 

Technical Program Chair
Victor M. Bright
University of Colorado, Boulder
USA
 

Regional Program Chairs

Americas
Gary Fedder
Carnegie Mellon University
USA
  Europe/Africa
Pasqualina M. Sarro
Delft University of Technology
THE NETHERLANDS

Asia/Oceania
Shuichi Shoji
Waseda University
JAPAN
 



Tuesday MIG Session Chair
Karen Lightman
MEMS Industry Group
 


Short Course Chair
Amy Herr
University of California, Berkeley
USA
 


Student Travel Support Chair
Robert Candler
University of California, Los Angeles
USA
 

Commercial Support Committee

Joe Brown
Joe Brown MEMS
USA
  Christofer Hierold
ETH Zurich
SWITZERLAND

Masayoshi Esashi
Tohoku University
JAPAN
  Dave Monk
Freescale Semiconductor
USA

Weileun Fang
National Tsing Hua University
TAIWAN
  Gary O'Brien
BOSCH
USA

Local Arrangements Committee

Karl Böhringer
University of Washington
USA
  Chip Spangler
Aspen Microsystems
USA

Boris Stoeber
University of British Columbia
CANADA
 



Treasurer
Dave Monk
Freescale Semiconductor
USA
 


Conference Manager
Katharine Cline
Preferred Meeting Management, Inc.
USA



International Steering Committee

Chair
Kenny, ThomasStanford University, US

Vice-Chair
Morante, J.R.Universitat de Barcelona and IREC, ES

Members
Akin, TayfunMiddle East Technical University, METU-MEMS Center, TR
Allen, MarkUniversity of Pennsylvania, US
Bausells, JoanBarcelona Microelectronics Institute, IMB-CNM (CSIC), ES
Bohringer, KarlUniversity of Washington, US
Brugger, JürgenEPFL, CH
Cho, Dong-il (Dan)Seoul National University, KR
Fang, WeilunNational Tsing Hua University, TW
Fedder, GaryCarnegie Mellon University, US
Gianchandani, YogeshUniversity of Michigan, US
Hsieh, JerweiAsia Pacific Microsystems, Inc., TW
Kattelus, HannuVTT, FI
Konishi, SatoshiRitsumeikan University, JP
Li, XinxinShanghai Institute of Microsystem and Information Technology, CN
Liu, Ai-QunNanyang Technological University, SG
Mehregany, MehranCase Western Reserve University, US
Monk, DaveFreescale Semiconductor, Inc., US
Nguyen, ClarkUniversity of California at Berkeley, US
Renard Stéphane Tronic's Microsystems, FR
Sarro, LinaDelft University of Technology, NL
Sawada, KazuakiToyohashi University of Technology, JP
Shoji, ShuichiWaseda University, JP
Yeatman, EricImperial College London, UK
Zengerle, RolandHSG-IMIT & IMTEK - University of Freiburg, DE

Ex-Officials
Chang, S. C.General Motors Research Laboratory, US
Chun, KukjinSeoul National University, KR
Delapierre, GillesCEA-LETI, FR
Esashi, MasayoshiTohoku University, JP
Fujita, HiroyukiUniversity of Tokyo, JP
Han, Sang-DoKorean Institute of Energy Research, KR
Hierold, ChristoferETH Zurich, CH
Hocker, G. BenjaminHoneywell International Inc, US
Howe, Roger T.Stanford University, US
Ishida, Makoto Toyohashi University of Technology, JP
Kataoka, ShoeiSharp Corporation, JP
Ko, Wen H.Case Western Reserve University, US
Lundström, IngemarLinköping University, SE
Middelhoek, SimonDeft University of Technology, NL
Moriizumi, ToyosakaTokyo Institute of Technology, JP
Muller, RichardUniversity of California Berkeley, US
Najafi, KhalilUniversity of Michigan, US
Pfister, G.Cerberus AG, CH
Puers, RobertKatholieke Universiteit Leuven, BE
de Rooij, NicoUniversity of Neuchatel, CH
Sasaki, AkioKyoto University, JP
Schmidt, MartinMassachusetts Institute of Technology, US
Schweitz, Jan-AkeUppsala University, SE
Seidel, HelmutUniversity of Saarland, Saarbrucken, DE
Senturia, Stephen D.Massachusetts Institute of Technology, US
Sohn, Byung-KiKyungpook National University, KR
Stemme, GöranRoyal Institute of Technology, Stockholm, SE
Syms, RichardImperial College of London, UK
Takahashi, Kiyoshi Kumamoto University School of Medicine, JP
Wise, Kensal D.University of Michigan, US
Xia, ShanhongInstitute of Electronics, Chinese Academy of Sciences, CN




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