Transducers 2009 - Denver, Colorado, USA
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657 N. Pastoria Avenue
Sunnyvale, CA 94085 USA
phone: 1-408-212-3200
fax: 1-408-720-3340

Booth 40

ALLVIA provides Through-Silicon Via specialty foundry services to MEMS and Semiconductor Industries meeting the demands of advanced vertical interconnects and System-in-Package (SiP) solutions. Through-Silicon vias provide the shortest electrical path between two sides of silicon die, allow miniaturization through 3D stacking, and support wafer level packaging (WLP) for RF and MEMS devices. With a full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs for manufacturing TSVs, silicon etching, copper plating, photolithography, CMP, etc.

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