Boston Transducers '03
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Short Course 1

Introduction to Packaging of Micro Electro-Mechanical Systems (MEMS)
Instructor: Victor M. Bright, University of Colorado, USA

MEMS technology uses advanced microfabrication techniques to produce miniaturized electro-mechanical systems that have feature sizes in the regime of 1 micron. Controllable motions from nanometers to millimeters can be realized with this technology for applications in the area of optics, wireless communication, information storage, and industrial and consumer instrumentation and control.

Fabrication and packaging of micro electromechanical systems (MEMS) is the subject of immense interest. MEMS packaging and integration with other components is challenging and unlike IC packaging, have different set of demands driven largely by application specific nature of MEMS components. Material selection and choice of package impacts performance, reliability, manufacturing yield and cost.

Traditional packaging materials and methods may not be adequate to meet the requirements of advanced microsystem designs. In response, numerous novel materials and packaging methodologies have been, and are continuing to be developed. This course is designed to provide a brief overview of MEMS technology and MEMS applications followed by survey of packaging techniques for MEMS-enabled microsystems.

Packaging of MEMS is discussed at device level, die level, and hybrid integration with other microelectronic components. Applications of established methods from microelectronics are discussed to package MEMS and/or build advanced microsystems at device level. The attendees will be given a clear overview of the available fabrication, packaging and integration techniques for MEMS so that they can envision applicability of the technology to their specific industry.